Radio frequency (RF) sputtering is a type of SPUTTERING that is ideal for target materials that have insulating qualities. Like direct current (DC) sputtering, this technique involves running an energetic wave through an inert gas to create positive ions.
RF sputtering needs about nine times more input voltage than DC sputtering because the creation of the radio waves requires more power input to achieve the same effect as an electron current. The plasma can be maintained in lower pressure than DC sputtering. As a result, a more direct pathway for the particles to travel to the substrate material is created by fewer collisions between the target material particles and the gas ions.
